Emi Ushioda

Title: Emi Ushioda: Innovator in Metallized Substrate Technology

Introduction

Emi Ushioda is a prominent inventor based in Yamaguchi, Japan. She has made significant contributions to the field of metallized substrates, holding 2 patents that showcase her innovative approach to manufacturing and plating methods.

Latest Patents

Her latest patents include a method for manufacturing a metallized substrate, which allows for the easier formation of fine patterns. This invention provides a metallized substrate that consists of a sintered nitride ceramic substrate, a titanium nitride layer, an adhesion layer containing copper and titanium, and a copper plating layer. The adhesion layer has a thickness ranging from 0.1 μm to 5 μm. Additionally, she has developed a plating method for circuit substrates that involves multiple steps to treat the conductive pattern, ensuring the removal of copper and silver oxides before performing electroless plating.

Career Highlights

Emi Ushioda is currently employed at Tokuyama Corporation, where she continues to advance her research and development in metallized substrate technologies. Her work has been instrumental in enhancing the efficiency and effectiveness of manufacturing processes in this field.

Collaborations

Throughout her career, she has collaborated with notable colleagues such as Yasuyuki Yamamoto and Tetsuo Imai, contributing to a dynamic and innovative work environment.

Conclusion

Emi Ushioda's contributions to metallized substrate technology reflect her dedication to innovation and excellence in her field. Her patents not only advance manufacturing techniques but also pave the way for future developments in circuit substrate technology.