The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 04, 2016
Filed:
Dec. 02, 2011
Naoto Takahashi, Yamaguchi, JP;
Yasuyuki Yamamoto, Yamaguchi, JP;
Emi Ushioda, Yamaguchi, JP;
TOKUYAMA CORPORATION, Shunan-shi, Yamaguchi, JP;
Abstract
The present invention provides: a method for manufacturing a metallized substrate by which a fine pattern can be formed more easily; a metallized substrate manufactured by the method; and a metal paste composition to be used in the method. The metallized substrate has: a sintered nitride ceramic substrate (); a titanium nitride layer () on the sintered substrate (); an adhesion layer () on the titanium nitride layer (); and a copper plating layer () on or above the adhesion layer (), wherein the adhesion layer () contains copper and titanium, and has a thickness of no less than 0.1 μm and no more than 5 μm.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile