This inventor holds 1 USPTO granted patent. Top assignee: Senju Metal Industry Co., Ltd.. Active years: 1978.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 1978
Title: Eikichi Takahashi: Innovator in Solder Technology
Introduction
Eikichi Takahashi is a notable inventor based in Matsudo, Japan. He has made significant contributions to the field of solder technology, particularly with his innovative approach to creating microspheres of solder.
Latest Patents
Takahashi holds a patent for a "Microsphere of solder having a metallic core and production thereof." This invention involves a microsphere of solder that features a metallic core, where the thickness of the solder coating exceeds 20 microns. The production process includes preparing a sheet with multiple hollows, placing a spherical metal grain along with solder grains in each hollow, and heating the assembly in the presence of flux to achieve the desired coating.
Career Highlights
Eikichi Takahashi is associated with Senju Metal Industry Co., Ltd., where he has been instrumental in advancing solder technology. His work has led to improved methods of producing solder microspheres, which are essential in various electronic applications.
Collaborations
Takahashi has collaborated with notable colleagues such as Toshihiko Taguchi and Kazuo Fujikura, contributing to the development of innovative solder solutions.
Conclusion
Eikichi Takahashi's contributions to solder technology through his patent and work at Senju Metal Industry Co., Ltd. highlight his role as a key innovator in the field. His advancements continue to influence the industry and pave the way for future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile