The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 27, 1978
Filed:
Dec. 30, 1975
Eikichi Takahashi, Matsudo, JA;
Toshihiko Taguchi, Showa, JA;
Kazuo Fujikura, Mooka, JA;
Toshihisa Sudo, Tokyo, JA;
Senju Metal Industry Co., Ltd., Tokyo, JA;
Abstract
A microsphere of solder having a metallic core, in which the thickness of the solder coating of the microsphere is more than 20 microns, can be produced by a process comprising preparing a sheet having a plurality of hollows provided all over the sheet, placing a spherical grain of a metal together with at least one grain of solder in each of said hollows, the metallic grain having wettability for solder, then heating the grains in the hollow in the presence of a flux to coat the metallic grain with the solder, and recovering a spherical solder bead having a metallic core.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile