Higashiizumo, Japan

Eiji Hirakawa

This inventor holds 4 USPTO granted patents. Top assignees: Hitachi Metals, Ltd., Nec Corporation. Active years: 1999-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eiji Hirakawa. Retrieved from https://idiyas.com/inventor/eiji-hirakawa

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.1

ph-index = 2

Forward Citations = 14(Granted Patents)


Location History:

  • Yasugi, JP (1999)
  • Shimane, JP (2000)
  • Yonago, JP (2006)
  • Higashiizumo, JP (2008)

Company Filing History:


Years Active: 1999-2008

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4 patents (USPTO):Explore Patents

Title: Eiji Hirakawa: Innovator in Plasma Processing Technologies

Introduction

Eiji Hirakawa is a notable inventor based in Higashiizumo, Japan. He has made significant contributions to the field of plasma processing, holding a total of 4 patents. His innovative work focuses on methods and apparatuses that enhance the efficiency and effectiveness of powder processing.

Latest Patents

Hirakawa's latest patents include a plasma processing apparatus for powder and a plasma processing method for powder. The plasma processing apparatus is designed to supply a powder material into a plasma flame generated inside a high-frequency coil. This apparatus features a powder supply nozzle that is arranged radially at the center of the coil, equipped with a revolving flow forming device, such as a spiral-shaped plate. This design allows the carrier gas and powder material to create a revolving flow directed axially of the high-frequency coil, which is then discharged from the nozzle's outlet. Additionally, a transition space is incorporated between the nozzle outlet and the revolving flow forming device, optimizing the flow dynamics.

The method of manufacturing a sintered body involves sealing a material powder, which consists of metallic or alloy powder, along with a getter material and a hydride, in a metallic container under reduced pressure. This mixture undergoes pressurized sintering while being heated, maintaining a pressure not exceeding 50 MPa and a temperature of at least 500°C for a duration of 1 to 50 hours. The process culminates in sintering the metallic and alloy powders at pressures above 50 MPa and temperatures not exceeding 1340°C.

Career Highlights

Throughout his career, Eiji Hirakawa has worked with prominent companies such as Hitachi Metals, Ltd. and NEC Corporation. His experience in these organizations has contributed to his expertise in plasma processing technologies and materials science.

Collaborations

Hirakawa has collaborated with notable colleagues, including Gang Han and Tomonori Ueno. Their joint efforts have further advanced the field of plasma processing and enhanced the development of innovative technologies.

Conclusion

Eiji Hirakawa's contributions to plasma processing technologies demonstrate his commitment to innovation and excellence in the field. His patents and career achievements reflect a deep understanding of materials and processing methods that continue to influence the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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