Eiichiro Saito

This inventor holds 13 USPTO granted patents and 5 published patent applications and 1 EPO patent. Top assignees: Panasonic Intellectual Property Management Co., Ltd., Matsushita Electric Works, Ltd., Panasonic Electric Works Co., Ltd.. Active years: 1992-2025.

USPTO Granted Patents = 13 (Patent Applications = 5)

% Patents Active = 100.0

EPO Patents = 1 (Patent Applications = 3)

Average Co-Inventor Count = 2.7

ph-index = 3

Forward Citations = 30(Granted Patents)

Location History:

Kadoma, JP (1992)
Kooriyama, JP (1994)
Moriguchi, JP (2003)
Osaka, JP (1992 - 2024)

Company Filing History:

7 out of 13,338

Panasonic Intellectual Property Management Co., Ltd.

patents

5 out of 1,623

Matsushita Electric Works, Ltd.

patents

1 out of 394

Panasonic Electric Works Co., Ltd.

patents

Years Active: 1992-2025

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13 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12441856 - Resin sheet, prepreg, insulating resin member, and printed wiring board (2025-10-14),

2. 12404399 - Thermosetting resin sheet and printed wiring board (2025-09-02),

3. 12006433 - Thermosetting resin composition, resin sheet, laminate, and printed wiring board (2024-06-11),

4. 11814502 - Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board (2023-11-14),

5. 11617261 - Resin composition, resin film, metal foil with resin, prepreg, metal-clad laminate, and printed wiring board (2023-03-28),

6. 11114354 - Printed wiring board, printed circuit board, prepreg (2021-09-07),

7. 10791633 - Thick conductor built-in type printed wiring board and method for producing same (2020-09-29),

8. 7838576 - Poly (phenylene ether) resin composition, prepreg, and laminated sheet (2010-11-23),

9. 7413791 - Poly (phenylene ether) resin composition, prepreg, and laminated sheet (2008-08-19),

10. 6589656 - Epoxy resin composition, prepreg and metal-clad laminate (2003-07-08),

11. 5312651 - Method for making a prepreg of an epoxy resin impregnated fiberglass (1994-05-17),

12. 5136015 - Addition type imide resin prepolymer, manufacturing method thereof, (1992-08-04),

13. 5112989 - Process for producing unsaturated mono and dicarboxylic acid imide (1992-05-12),

Title: The Innovations of Eiichiro Saito

Introduction

Eiichiro Saito is a prominent inventor based in Osaka, Japan. He has made significant contributions to the field of thermosetting resin compositions, holding a total of 13 patents. His work has been instrumental in advancing materials used in various electronic applications.

Latest Patents

Saito's latest patents include innovations such as a resin sheet, prepreg, insulating resin member, and printed wiring board. One of his notable inventions is a resin sheet that comprises an uncured or semi-cured product of a thermosetting resin composition. This resin sheet exhibits a melt viscosity ranging from 10 Pa·s to 2000 Pa·s when measured under specific conditions. Additionally, he has developed a thermosetting resin sheet that consists of a prepreg layer and a resin sheet layer, where the curing time of the resin sheet layer is longer than that of the prepreg layer.

Career Highlights

Throughout his career, Saito has worked with notable companies such as Panasonic Intellectual Property Management Co., Ltd. and Matsushita Electric Works, Ltd. His expertise in resin technology has positioned him as a key figure in the development of advanced materials for electronic devices.

Collaborations

Saito has collaborated with esteemed colleagues, including Akihiro Yamauchi and Kouichi Aoki. These partnerships have further enhanced his innovative capabilities and contributed to the success of his projects.

Conclusion

Eiichiro Saito's contributions to the field of thermosetting resins have led to numerous patents and advancements in electronic materials. His work continues to influence the industry and inspire future innovations.