The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 29, 2020
Filed:
Dec. 18, 2017
Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;
Abstract
A thick conductor built-in type printed wiring board includes a printed wiring board, an insulating resin layer, an insulating base material layer, and a conductor layer. The printed wiring board includes an insulating layer including a cured product of a first resin composition, and a circuit provided on one main surface or both main surfaces of the insulating layer, the circuit having a plurality of conductor wirings each having a thickness ranging from 105 μm to 630 μm, inclusive. The insulating resin layer covers a surface of the printed wiring board on which the circuit is provided, and includes a cured product of a second resin composition and includes no fibrous base material. The insulating base material layer covers the insulating resin layer, and includes a cured product of a third resin composition and a fibrous base material. The conductor layer covers the insulating base material layer. The thick conductor built-in type printed wiring board does not include a void having a diameter of more than or equal to 10 μm inside the thick conductor built-in type printed wiring board.