The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 07, 2021

Filed:

Aug. 22, 2017
Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Akira Ito, Osaka, JP;

Eiichiro Saito, Osaka, JP;

Kengo Yamanouti, Fukushima, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H01L 23/14 (2006.01); H01L 23/12 (2006.01); H05K 3/46 (2006.01); H01L 23/15 (2006.01); H05K 1/03 (2006.01); H05K 1/02 (2006.01);
U.S. Cl.
CPC ...
H01L 23/142 (2013.01); H01L 23/12 (2013.01); H01L 23/14 (2013.01); H01L 23/15 (2013.01); H05K 1/0306 (2013.01); H05K 3/4626 (2013.01); H05K 3/4655 (2013.01); H05K 1/0271 (2013.01); H05K 1/0366 (2013.01); H05K 1/0373 (2013.01); H05K 2201/068 (2013.01);
Abstract

A printed wiring board includes: an inner insulating layer including a conductive wire; a first outermost insulating layer disposed on a first surface of the inner insulating layer; and a second outermost insulating layer disposed on a second surface of the inner insulating layer. A bending elastic modulus of each of the first outermost insulating layer and the second outermost insulating layer ranges from ¼ to ¾, inclusive, of a bending elastic modulus of the inner insulating layer. A glass transition temperature of each of the first outermost insulating layer and the second outermost insulating layer falls within ±20° C. of a glass transition temperature of the inner insulating layer.


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