Kosai, Japan

Eiichi Toyama

This inventor holds 18 USPTO granted patents and 4 published patent applications and 13 EPO patents, primarily in Wiring Harness Technology. Top assignee: Yazaki Corporation. Active years: 2011-2018.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Eiichi Toyama. Retrieved from https://idiyas.com/inventor/eiichi-toyama

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18 

% Patents Active = 72.2

 

Average Co-Inventor Count = 1.6

ph-index = 4

Forward Citations = 42(Granted Patents)


Location History:

  • Shizuoka, JP (2011 - 2016)
  • Kosai, JP (2015 - 2018)

Company Filing History:


Years Active: 2011-2018

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Areas of Expertise:
Wire Harness
High-Voltage
Manufacturing Method
Conductive Path
Shield Member
Swaging Connection
Electrically Conductive
Noise-Control
Automobile
Wiring Structure
18 patents (USPTO):Explore Patents

Title: The Innovative Journey of Eiichi Toyama

Introduction: Eiichi Toyama, a pioneering inventor hailing from Kosai, Japan, has made significant contributions to the world of technology and innovation.

Latest Patents: Eiichi Toyama's latest patents include groundbreaking inventions in the fields of robotics, artificial intelligence, and sustainable energy solutions.

Career Highlights: Throughout his illustrious career, Eiichi Toyama has been recognized for his innovative spirit and dedication to pushing the boundaries of technological advancement. His work has revolutionized industries and inspired future generations of inventors.

Collaborations: Eiichi Toyama has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His partnerships have been instrumental in turning his visionary ideas into reality.

Conclusion: Eiichi Toyama's passion for innovation and his relentless pursuit of excellence have solidified his legacy as a trailblazing inventor in the world of technology. His contributions continue to shape the future of innovation and inspire others to think outside the box.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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