Eiichi Taketani

Title: Eiichi Taketani: Semiconductor Device Inventor

Introduction

Eiichi Taketani is an inventor associated with Denso Corporation and located in Nukata-gun, Japan. His patent work focuses on semiconductor devices and their manufacturing methods. He is credited with 3 patents.

Latest Patents

Taketani’s listed recent patents include “Semiconductor Device and Method for Manufacturing Same” and “Semiconductor Device Having a Trench Gate Structure and Manufacturing Method of the Same.”

“Semiconductor Device and Method for Manufacturing Same” describes preparing two substrates, forming and patterning metal films with titanium as the outermost layer to create pad portions, and vacuum-annealing the substrates to remove oxide from the titanium surfaces. The pad portions are then bonded together.

“Semiconductor Device Having a Trench Gate Structure and Manufacturing Method of the Same” concerns forming a trench in a semiconductor substrate and creating an adjustment layer near its bottom wall. The adjustment layer helps control the depth of a channel layer formed along the trench sidewall.

Career Highlights

Taketani’s listed inventions address semiconductor fabrication and device structure. The patent descriptions highlight techniques for bonding substrate pads and controlling channel formation in trench-gate devices.

Collaborations

His listed coworkers include Seigo Oosawa and Toshihiko Takahata. The provided information identifies these professional associations but does not specify their roles in particular patents.

Conclusion

Eiichi Taketani’s patent portfolio reflects work on semiconductor bonding processes and trench-gate device manufacturing, with his listed inventions associated with Denso Corporation.