The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 15, 2015

Filed:

Apr. 10, 2012
Applicants:

Eiichi Taketani, Nukata-gun, JP;

Seigo Oosawa, Nukata-gun, JP;

Inventors:

Eiichi Taketani, Nukata-gun, JP;

Seigo Oosawa, Nukata-gun, JP;

Assignee:

DENSO CORPORATION, Kariya, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/335 (2006.01); H01L 29/10 (2006.01); H01L 21/28 (2006.01); H01L 29/08 (2006.01); H01L 29/66 (2006.01); H01L 29/78 (2006.01); H01L 21/336 (2006.01); H01L 21/265 (2006.01); H01L 29/06 (2006.01); H01L 29/417 (2006.01); H01L 29/423 (2006.01); H01L 29/739 (2006.01);
U.S. Cl.
CPC ...
H01L 29/1095 (2013.01); H01L 21/28211 (2013.01); H01L 29/0878 (2013.01); H01L 29/66727 (2013.01); H01L 29/66734 (2013.01); H01L 29/7808 (2013.01); H01L 29/7813 (2013.01); H01L 21/26586 (2013.01); H01L 29/0626 (2013.01); H01L 29/41766 (2013.01); H01L 29/42368 (2013.01); H01L 29/7397 (2013.01);
Abstract

In a manufacturing method of a semiconductor device, a trench is defined in a semiconductor substrate, and an adjuster layer having a first conductivity type impurity concentration higher than a drift layer is formed at a portion of the semiconductor substrate adjacent to a bottom wall of the trench. A channel layer is formed by introducing second conductivity type impurities to a portion of the semiconductor substrate adjacent to a sidewall of the trench and between the adjustment layer and a main surface of the semiconductor substrate while restricting the channel layer from extending in a depth direction of the trench by the adjustment layer.


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