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For the Inventor, By the Inventor

Vestal, NY, United States of America

Edmond Otto Fey

USPTO Granted Patents = 18

Average Co-Inventor Count = 4.8

ph-index = 7

Forward Citations = 93(Granted Patents)


Company Filing History:

goldMedal18 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1982-2008

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18 patents (USPTO):
1. 7378227 - Method of making a printed wiring board with conformally plated circuit traces (2008-05-27),
2. 6931722 - Method of fabricating printed circuit board with mixed metallurgy pads (2005-08-23),
3. 6843929 - Accelerated etching of chromium (2005-01-18),
4. 6815126 - Printed wiring board with conformally plated circuit traces (2004-11-09),
5. 6607613 - Solder ball with chemically and mechanically enhanced surface properties (2003-08-19),
6. 6586683 - Printed circuit board with mixed metallurgy pads and method of fabrication (2003-07-01),
7. 6544584 - Process for removal of undesirable conductive material on a circuitized substrate and resultant circuitized substrate (2003-04-08),
8. 6335495 - Patterning a layered chrome-copper structure disposed on a dielectric substrate (2002-01-01),
9. 6210547 - Enhanced solder surface and process for chemically and mechanically enhancing solder surface properties (2001-04-03),
10. 6063481 - Process for removal of undersirable conductive material on a circuitized (2000-05-16),
11. 6056831 - Process for chemically and mechanically enhancing solder surface (2000-05-02),
12. 6046500 - Method of controlling the spread of an adhesive on a circuitized organic (2000-04-04),
13. 5910341 - Method of controlling the spread of an adhesive on a circuitized organic (1999-06-08),
14. 5311660 - Methyl chloroform-free desmear process in additive circuitization (1994-05-17),
15. 4967690 - Electroless plating with bi-level control of dissolved oxygen, with (1990-11-06),

Title: The Innovative Contributions of Edmond Otto Fey

Introduction

Edmond Otto Fey is a notable inventor based in Vestal, NY, with a remarkable portfolio of 18 patents. His work primarily focuses on advancements in printed circuit board technology, showcasing his expertise in the field of electronics and engineering.

Latest Patents

Among his latest patents, Fey has developed a method of making a printed wiring board with conformally plated circuit traces. This innovative process significantly reduces the incidence of failure in printed wiring boards by applying a thin commoning layer of copper onto a catalyzed surface. The method involves several steps, including the application of photoresist and the electrodeposition of nickel and gold layers, which enhance the durability and reliability of the circuit traces. Another significant patent is the method of fabricating printed circuit boards with mixed metallurgy pads. This method includes forming an oxide layer and a solder mask, which improves the functionality and performance of printed circuit devices.

Career Highlights

Fey's career is marked by his association with International Business Machines Corporation (IBM), where he has contributed to various projects and innovations in the field of electronics. His extensive experience and knowledge have made him a valuable asset to the company.

Collaborations

Throughout his career, Fey has collaborated with notable colleagues, including Thomas R. Miller and Edward Lee Arrington. These partnerships have fostered a creative environment that has led to significant advancements in their respective fields.

Conclusion

Edmond Otto Fey's contributions to the field of printed circuit board technology are noteworthy and impactful. His innovative patents and collaborations reflect his dedication to advancing technology and improving electronic devices.

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