Sint-Niklaas, Belgium

Edmond De Volder


 

Average Co-Inventor Count = 5.1

ph-index = 4

Forward Citations = 45(Granted Patents)


Location History:

  • Slint-Niklaas, BE (2002)
  • Sint-Niklaas, BE (2014 - 2016)

Company Filing History:


Years Active: 2002-2016

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4 patents (USPTO):Explore Patents

Title: Innovations of Edmond De Volder

Introduction

Edmond De Volder is a notable inventor based in Sint-Niklaas, Belgium. He has made significant contributions to the field of sensor technology, holding a total of four patents. His work focuses on innovative methods for manufacturing sensors, showcasing his expertise and creativity in this area.

Latest Patents

One of his latest patents is a method of manufacturing a sensor. This method involves encapsulation-molding a sensor element, which includes at least a first housing. The encapsulation-molding process results in the formation of a sensor housing. The sensor element is mechanically connected to a support element and/or accommodated by the support element. Following this, both the sensor element and the support element are encapsulation-molded together to create the final sensor housing. Another patent he holds is for a sensor element and carrier element for manufacturing a sensor, which follows a similar encapsulation-molding process to achieve the desired results.

Career Highlights

Edmond De Volder is associated with Continental Teves AG & Co. OHG, where he applies his innovative ideas and technical skills. His work at this company has allowed him to further develop his inventions and contribute to advancements in sensor technology.

Collaborations

He has collaborated with notable coworkers such as Andreas Doering and Dietmar Huber, enhancing the innovation process through teamwork and shared expertise.

Conclusion

Edmond De Volder's contributions to sensor technology through his patents and collaborations highlight his role as a significant inventor in the field. His innovative methods continue to influence the development of advanced sensor systems.

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