The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 23, 2016
Filed:
Feb. 28, 2013
Continental Teves Ag & Co. Ohg, Frankfurt, DE;
Edmond De Volder, Sint-Niklaas, BE;
Dietmar Huber, Eichstätt, DE;
Andreas Doering, Düsseldorf, DE;
Jakob Schillinger, Gaimersheim, DE;
Martin Watzlawik, Maintal, DE;
Lothar Biebricher, Oberursel, DE;
Abstract
A method for manufacturing a sensor in which a sensor element, which comprises at least a first housing, is at least partially encapsulation-molded in an encapsulation-molding process. As a result of the encapsulation-molding process a sensor housing is formed. The sensor element is mechanically connected to a support element and/or accommodated by the support element, after which the sensor element and the support element are encapsulation-molded in a common encapsulation-molding process for forming the sensor housing.