The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 02, 2014

Filed:

Oct. 01, 2009
Applicants:

Andreas Doering, Düsseldorf, DE;

Edmond DE Volder, Sint-Niklaas, BE;

Dietmar Huber, Eichstätt, DE;

Jakob Schillinger, Gaimersheim, DE;

Martin Watzlawik, Maintal, DE;

Inventors:

Andreas Doering, Düsseldorf, DE;

Edmond De Volder, Sint-Niklaas, BE;

Dietmar Huber, Eichstätt, DE;

Jakob Schillinger, Gaimersheim, DE;

Martin Watzlawik, Maintal, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01C 19/54 (2006.01); H01L 21/00 (2006.01); B29C 45/14 (2006.01); G01D 11/24 (2006.01); B29L 31/30 (2006.01);
U.S. Cl.
CPC ...
B29C 45/14655 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/48137 (2013.01); B29L 2031/3061 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/45144 (2013.01); G01D 11/245 (2013.01);
Abstract

A method for producing a sensor element, wherein at least parts of the sensor element are subjected to at least one plasma treatment process during production. The plasma treatment process may be either a plasma cleaning process and/or a plasma activation process. During the plasma treatment process, a base element and/or a carrier element of the sensor element is subjected to a plasma treatment process before a placement process and/or before a contact-connecting process with electrical connection means. The sensor element is equipped with at least one measurement probe element and/or at least one electronic circuit. This method is used to produce a sensor element, such as a speed sensor element, that may be used in a motor vehicle.


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