Ed A Schrock

This inventor holds 20 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: Micron Technology Incorporated. Active years: 1991-2024.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Ed A Schrock. Retrieved from https://idiyas.com/inventor/ed-a-schrock

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 20

% Patents Active = 90.0

Average Co-Inventor Count = 1.3

ph-index = 6

Forward Citations = 116(Granted Patents)

Company Filing History:

20 out of 39,222

Micron Technology Incorporated

patents

Years Active: 1991-2024

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Areas of Expertise:

Thermal Transfer Structures

Semiconductor Die

Epoxy Loc Die Attachment

Microelectronic Device

Wafers

Manufacturing Methods

Die Assembly

Resin Bleed Reduction

Workpiece Support

Blade Detector

Substrate Attachment

Methods

20 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11862611 - Thermal transfer structures for semiconductor die assemblies (2024-01-02),

2. 11222868 - Thermal transfer structures for semiconductor die assemblies (2022-01-11),

3. 8455983 - Microelectronic device wafers and methods of manufacturing (2013-06-04),

4. 8062958 - Microelectronic device wafers and methods of manufacturing (2011-11-22),

5. 7220616 - Methods for epoxy loc die attachment (2007-05-22),

6. 7153788 - Method and apparatus for attaching a workpiece to a workpiece support (2006-12-26),

7. 7115976 - Method and apparatus for epoxy LOC die attachment (2006-10-03),

8. 6858469 - Method and apparatus for epoxy loc die attachment (2005-02-22),

9. 6719550 - Apparatus for epoxy loc die attachment (2004-04-13),

10. 6562277 - Method and apparatus for attaching a workpiece to a workpiece support (2003-05-13),

11. 6353268 - Semiconductor die attachment method and apparatus (2002-03-05),

12. 6352422 - Method and apparatus for epoxy loc die attachment (2002-03-05),

13. 6221691 - Method and system for attaching semiconductor dice to substrates (2001-04-24),

14. 6174752 - Method and apparatus for epoxy loc die attachment (2001-01-16),

15. 6110805 - Method and apparatus for attaching a workpiece to a workpiece support (2000-08-29),

Title: Innovator Spotlight: Ed A Schrock Revolutionizing Semiconductor Technology

Introduction:

Ed A Schrock, a prolific inventor based in Boise, ID, with a remarkable portfolio of 20 patents, is making waves in the semiconductor industry. His groundbreaking work in thermal transfer structures for semiconductor die assemblies showcases his ingenuity and expertise.

Latest Patents:

Schrock's latest patents focus on thermal transfer structures for semiconductor die assemblies, emphasizing the importance of efficient heat dissipation in semiconductor devices. These innovations highlight his commitment to advancing technological solutions in the field of semiconductors.

Career Highlights:

Currently working at Micron Technology Incorporated, a leading semiconductor company, Ed A Schrock continues to push the boundaries of innovation. His dedication to developing cutting-edge technologies underscores his status as a key player in the semiconductor industry.

Collaborations:

Schrock has collaborated with industry peers such as Tongbi T Jiang and Alan G Wood, demonstrating his ability to work effectively in multidisciplinary teams. These collaborations have resulted in the successful implementation of innovative semiconductor solutions.

Conclusion:

Ed A Schrock's impact on the semiconductor industry is undeniable, with his patents paving the way for enhanced thermal management in semiconductor devices. His continued dedication to innovation and collaboration positions him as a visionary inventor at the forefront of semiconductor technology.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]