The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 02, 2024
Filed:
Dec. 08, 2021
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventor:
Ed A. Schrock, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 25/065 (2023.01); H01L 23/367 (2006.01); H01L 23/31 (2006.01); H01L 23/053 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/10 (2006.01); H01L 23/24 (2006.01); H01L 23/433 (2006.01); H01L 23/08 (2006.01); H01L 23/373 (2006.01); H01L 25/18 (2023.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); H01L 21/4803 (2013.01); H01L 21/4817 (2013.01); H01L 21/563 (2013.01); H01L 21/565 (2013.01); H01L 23/053 (2013.01); H01L 23/08 (2013.01); H01L 23/10 (2013.01); H01L 23/24 (2013.01); H01L 23/3142 (2013.01); H01L 23/367 (2013.01); H01L 23/3675 (2013.01); H01L 23/4334 (2013.01); H01L 23/3736 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/29 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 25/18 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13111 (2013.01); H01L 2224/13147 (2013.01); H01L 2224/13155 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29301 (2013.01); H01L 2224/29393 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73253 (2013.01); H01L 2224/81815 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06555 (2013.01); H01L 2225/06589 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/1437 (2013.01); H01L 2924/1616 (2013.01); H01L 2924/16195 (2013.01); H01L 2924/16235 (2013.01); H01L 2924/16251 (2013.01); H01L 2924/173 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/19041 (2013.01); H01L 2924/19105 (2013.01);
Abstract
Several embodiments of the present technology are described with reference to a semiconductor apparatus. In some embodiments of the present technology, a semiconductor apparatus includes a stack of semiconductor dies attached to a thermal transfer structure. The thermal transfer structure conducts heat away from the stack of semiconductor dies. Additionally, the assembly can include molded walls to support the thermal transfer structure.