Dwayne Richard Shirley

Title: Innovator Spotlight: Dwayne Richard Shirley

Introduction: Dwayne Richard Shirley is a prominent inventor based in San Diego, California, known for his significant contributions to the field of integrated circuit packaging. With three patents to his name, Shirley has developed innovative solutions that enhance the performance and reliability of electronic devices.

Latest Patents: Shirley's latest patents showcase his inventive prowess in the realm of integrated circuits. One of his notable inventions is a lid for integrated circuit packages, which features a heat conductive substrate, a crystallized amorphous silicon layer, and a native silicon oxide layer. Additionally, an alternative design incorporates a copper substrate with a native silicon oxide layer, interconnected through intermediate layers. This innovation is essential for providing efficient heat paths within integrated circuit packages.

Another remarkable patent by Shirley addresses protective measures for conductive posts in integrated circuit packages. His design includes a substrate/interposer assembly with multiple conductive contacts and copper posts, all encased in a protective dielectric, such as a photoimageable dielectric. This enhances the durability and functionality of integrated circuits, allowing additional integrated circuit dies to be incorporated in a package-on-package configuration.

Career Highlights: Throughout his career, Dwayne Richard Shirley has held key positions in reputable companies, including Texas Instruments and Qualcomm. His work has significantly influenced advancements in technology, particularly in the development of efficient electronic components.

Collaborations: Shirley has collaborated with esteemed colleagues, including Jie Fu and Chin-Kwan Kim. Their joint efforts have led to innovative breakthroughs in integrated circuit technology, further solidifying Shirley’s reputation as an influential figure in the industry.

Conclusion: Dwayne Richard Shirley stands out as a remarkable inventor whose work continues to shape the landscape of integrated circuit packaging. His patents reflect a commitment to excellence and innovation, making him a valuable contributor to the advancement of technology in the electronics sector.