The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2017
Filed:
Sep. 20, 2015
Qualcomm Incorporated, San Diego, CA (US);
Jie Fu, San Diego, CA (US);
Chin-Kwan Kim, San Diego, CA (US);
Manuel Aldrete, Encinitas, CA (US);
Milind Pravin Shah, San Diego, CA (US);
Dwayne Richard Shirley, San Diego, CA (US);
QUALCOMM Incorporated, San Diego, CA (US);
Abstract
An integrated circuit package includes a substrate/interposer assembly having a plurality of conductive contacts and a plurality of conductive posts, such as copper posts, electrically coupled to at least some of the conductive contacts in the substrate/interposer assembly. The conductive posts are surrounded by a protective dielectric, such as a photoimageable dielectric (PID). An integrated circuit die may be disposed on the substrate/interposer assembly within an interior space surrounded by the dielectric. An additional integrated circuit die may be provided in a package-on-package (POP) configuration.