Danbury, CT, United States of America

Dudley A Chance

This inventor holds 18 USPTO granted patents, primarily in Semiconductor Packaging. Top assignee: International Business Machines Corporation. Active years: 1982-1994.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dudley A Chance. Retrieved from https://idiyas.com/inventor/dudley-a-chance

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 2.5

ph-index = 11

Forward Citations = 506(Granted Patents)


Location History:

  • Danbury, CT (US) (1982 - 1985)
  • Newtown, CT (US) (1989 - 1993)
  • Newton, CT (US) (1992 - 1994)

Company Filing History:


Years Active: 1982-1994

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Areas of Expertise:
Metal Powder Production
Hermetic Package
Semiconductor Chip
Integrated Circuit
Dielectric Laminated
Ceramic Substrates
Doped Titanate Glass
Electrolytic Printing
Capacitive Chip Carrier
VLSI Chips
Layered Metal Film
Low Inductance Capacitor
18 patents (USPTO):Explore Patents

Title: Innovations of Dudley A Chance

Introduction

Dudley A Chance is a notable inventor based in Danbury, CT (US), recognized for his significant contributions to the field of materials science and electrical engineering. He holds a total of 18 patents, showcasing his innovative approach to developing advanced technologies.

Latest Patents

Among his latest patents is a method for producing metal powder with a uniform supersaturation. This method involves fabricating powders of electrically conductive particles that are supersaturated with grain growth control additives. The process includes atomizing a molten admixture of electrically conductive material and grain growth control additive in an inert atmosphere, resulting in fine molten particles that cool rapidly to form solid particles. These supersaturated particles can be heated to create electrical conductors with grain sizes less than 25 microns. Additionally, he has developed a hermetic package for electronic devices, which is manufactured using a green glass ceramic body and a green via. This innovative package ensures electrical conductivity while maintaining hermeticity, making it suitable for various electronic applications.

Career Highlights

Dudley A Chance has made significant strides in his career, particularly through his work at International Business Machines Corporation (IBM). His expertise in materials science has led to advancements in electronic device packaging and conductive materials.

Collaborations

He has collaborated with notable coworkers, including David B Goland and Chung W Ho, contributing to the development of innovative technologies and patents.

Conclusion

Dudley A Chance's work exemplifies the spirit of innovation in the field of electrical engineering and materials science. His patents reflect a commitment to advancing technology and improving electronic device performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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