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For the Inventor, By the Inventor

Portland, OR, United States of America

Dudi I Amir

This inventor holds 8 USPTO granted patents and 1 published patent application. Top assignee: Intel Corporation. Active years: 2003-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dudi I Amir. Retrieved from https://idiyas.com/inventor/dudi-i-amir

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 8 

% Patents Active = 50.0

Average Co-Inventor Count = 1.2

ph-index = 3

Forward Citations = 34(Granted Patents)


Company Filing History:

goldMedal8 out of 56,290 
 
Intel Corporation
 patents

Years Active: 2003-2009

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8 patents (USPTO):Explore Patents
1. 7538440 - Method for improved high current component interconnections (2009-05-26),
2. 7185799 - Method of creating solder bar connections on electronic packages (2007-03-06),
3. 6933449 - Selective area solder placement (2005-08-23),
4. 6840169 - Methods for manufacturing printed circuit boards using a partial printing process and apparatus (2005-01-11),
5. 6823783 - Blocking cap for use in a partial printing process and apparatus (2004-11-30),
6. 6787920 - Electronic circuit board manufacturing process and associated apparatus (2004-09-07),
7. 6626099 - Partial printing process and apparatus (2003-09-30),
8. 6555761 - Printed circuit board with solder-filled via (2003-04-29),

Title: Dudi I Amir: Innovator in Electronic Packaging Technology

Introduction

Dudi I Amir is a prominent inventor based in Portland, OR (US). He has made significant contributions to the field of electronic packaging technology, holding a total of 8 patents. His innovative approaches have paved the way for advancements in high current component interconnections and solder connections in electronic packages.

Latest Patents

Among his latest patents is a method for improved high current component interconnections. This invention involves a printed circuit board with at least one conductive region covered in solder paste, where preformed solder elements are strategically placed. When a component package is positioned over the conductive region and the solder is reflowed, it forms a wide solder interconnection between the component and the printed circuit board. Another notable patent is the method of creating solder bar connections on electronic packages. This method allows for solder connections that are longer than their width by positioning solder balls of power or ground connections close enough to combine during reflow, while keeping signal solder balls separated.

Career Highlights

Dudi I Amir is currently employed at Intel Corporation, where he continues to innovate and develop new technologies in electronic packaging. His work has been instrumental in enhancing the reliability and performance of electronic devices.

Collaborations

Throughout his career, Dudi has collaborated with notable colleagues, including Tom E Pearson and Terrance J Dishongh. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Dudi I Amir's contributions to electronic packaging technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of the complexities involved in electronic connections, making him a valuable asset in the field.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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