The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 29, 2003
Filed:
Dec. 29, 2000
Applicant:
Inventor:
Dudi Amir, Portland, OR (US);
Assignee:
Intel Corporation, Santa Clara, CA (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
U.S. Cl.
CPC ...
H01R 1/204 ; H05K 1/11 ;
Abstract
A plated-through hole via is substantially filled with solder rather than with traditional polymer to reduce printed circuit board failure due to outgassing from improperly cured polymer via fill. The solder via fill is in some embodiments eutectic or high-temperature solder, and in some further embodiments is capped at least one end with a barrier.