Company Filing History:
Years Active: 2001-2007
Title: Duane Cook: Innovator in Optical Packaging and Integrated Circuit Technology
Introduction
Duane Cook is a notable inventor based in San Jose, California. He has made significant contributions to the fields of optical packaging and integrated circuit technology. With a total of 7 patents to his name, Cook has demonstrated a commitment to innovation and advancement in his field.
Latest Patents
One of Cook's latest patents is for a planar lightwave circuit package. This invention features an optical packaging arrangement that combines a planar lightwave circuit (PLC) with an array of waveguides, photodetectors, and a collimating faceplate. The faceplate serves as a cover for a hermetic cavity that encompasses the photodetectors, allowing for efficient coupling of output light beams. Another significant patent involves a controlled collapse chip connection (C4) integrated circuit package that utilizes two dissimilar underfill materials. This design aims to prevent cracking of the epoxy during thermo-mechanical loading, enhancing the reliability of integrated circuit packages.
Career Highlights
Throughout his career, Duane Cook has worked with prominent companies such as Intel Corporation and JDS Uniphase Corporation. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking technologies in the industry.
Collaborations
Cook has collaborated with talented individuals, including Suresh Ramalingam and Douglas E. Crafts. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.
Conclusion
Duane Cook's contributions to optical packaging and integrated circuit technology highlight his role as a leading inventor in the field. His innovative patents and collaborations reflect a dedication to advancing technology and improving product reliability.