The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 28, 2006
Filed:
Jun. 05, 2001
Suresh Ramalingam, Fremont, CA (US);
Venkatesan Murali, San Jose, CA (US);
Duane Cook, San Jose, CA (US);
Suresh Ramalingam, Fremont, CA (US);
Venkatesan Murali, San Jose, CA (US);
Duane Cook, San Jose, CA (US);
Intel Corporation, Santa Clara, CA (US);
Abstract
An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.