Intel Corporation

Jds Uniphase Corporation

Duane Cook

Suresh Ramalingam

Douglas E Crafts

James F Farrell

Venkatesan Murali

Mark Brian Farrelly

Satyanarayana Rao Peddada

Nagesh K Vodrahalli

Kenzo Ishida

Steven M Swain

David J Chapman

Arne Schonert

Steve Swain

An optical packaging arrangement combines a planar lightwave circuit (PLC) having an array of waveguides thereon, an array of photodetectors on a substrate to receive light beams coupled out of the PLC by the output ports, and a collimating faceplate, having a plurality of glass cores, extending between the PLC and the photodetector array for coupling the output light beams to respective photodetectors. The faceplate forms a cover for a hermetic cavity encompassing the photodetectors. The PLC is disposed either co-planarly with the faceplate or transversely to it. Light from the PLC is tapped via a plurality of taps formed on the PLC for coupling to the photodetectors.

Planar lightwave circuit package

An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.

Controlled collapse chip connection (C4) integrated circuit package which has two dissimilar underfill materials

A capillary has an opening of a dimension for accommodating an insertion of a first and second optical fiber, a clamp to provide a clamping force to the capillary to removably couple the capillary to the clamp, and a capillary rotator removably coupled to the capillary to apply a rotational force to the capillary which is greater than the capillary force, to rotate the capillary to a selected position. An optical fiber rotator can be disposed adjacent to the first optical fiber to rotate the first optical fiber such that the first optical fiber has a selected orientation with respect to the second optical fiber.

Method and apparatus for aligning and orienting polarization maintaining optical fibers

An optical component package, in which a transfer molded layer of material (e.g., syntactic foam in one embodiment) is formed at least partially around, or entirely around, the optical component to provide structural and thermal insulation around the component. The optical component may be a planar lightwave circuit (PLC), with a protective passivation layer formed between the PLC and the layer of syntactic foam, to de-couple stresses and thermal transfer between the PLC and the layer of syntactic foam. Strengthening caps, fiber assemblies, and a heater may be provided with the PLC assembly, around which the layer of syntactic foam can also be formed. The protective passivation layer can also be formed between these structures and the syntactic foam; in one embodiment between at least two strengthening caps formed on opposing edges of the PLC. The disclosed package provides numerous structural, thermal and size benefits.

Transfer molded packages with embedded thermal insulation

A high throughput process line and method for underfilling an integrated circuit that is mounted to a substrate. The process line includes a first dispensing station that dispenses a first underfill material onto the substrate and an oven which moves the substrate while the underfill material flows between the integrated circuit and the substrate. The process line removes flow time (wicking time) as the bottleneck for achieving high throughput.

Process line for underfilling a controlled collapse

A partial gel step in the underfilling of an integrated circuit that is mounted to a substrate. The process involves dispensing a first underfill material and then heating the underfill material to a partial gel state. The partial gel step may reduce void formation and improve adhesion performance during moisture loading.

Process for underfilling a controlled collapse chip connection (C4) integrated circuit package with an underfill material that is heated to a partial gel state

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San Jose, CA, United States of America

Duane Cook