Berlin, Germany

Donny Lautan

USPTO Granted Patents = 3 

 

Average Co-Inventor Count = 2.8

ph-index = 1


Company Filing History:


Years Active: 2016-2022

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3 patents (USPTO):Explore Patents

Title: Donny Lautan: Innovator in Electroless Plating Technologies

Introduction

Donny Lautan is a prominent inventor based in Berlin, Germany. He has made significant contributions to the field of electroless plating, holding three patents that showcase his innovative approach to metal deposition processes. His work is particularly relevant in the electronics industry, where precision and quality are paramount.

Latest Patents

Lautan's latest patents include an electroless gold plating bath and a pre-treatment process for electroless plating. The electroless gold plating bath is designed to enhance the efficiency and effectiveness of gold deposition on various substrates. The pre-treatment process addresses common challenges in electroless plating, such as skip plating and extraneous plating. This process involves several steps, including activating copper features with noble metal ions and using a specialized aqueous pre-treatment composition to ensure optimal plating conditions.

Career Highlights

Donny Lautan is currently employed at Atotech Deutschland GmbH, a company known for its advanced plating technologies. His role at Atotech allows him to apply his expertise in electroless plating to develop innovative solutions for the electronics sector. His contributions have been instrumental in advancing the company's product offerings and enhancing their competitive edge in the market.

Collaborations

Lautan has collaborated with notable colleagues, including Christian Noethlich and Robert Spreemann. These partnerships have fostered a collaborative environment that encourages the exchange of ideas and the development of cutting-edge technologies in the field of plating.

Conclusion

Donny Lautan's work in electroless plating technologies exemplifies the impact of innovation in the electronics industry. His patents and contributions continue to shape the future of metal deposition processes, ensuring high-quality standards in electronic devices.

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