The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 13, 2016
Filed:
Jan. 07, 2014
Applicant:
Atotech Deutschland Gmbh, Berlin, DE;
Inventors:
Assignee:
Atotech Deutschland GmbH, Berlin, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B05D 3/10 (2006.01); C23C 18/18 (2006.01); H01L 21/288 (2006.01); H05K 1/09 (2006.01); H05K 3/18 (2006.01); C23C 18/36 (2006.01); C23C 18/44 (2006.01); H05K 3/24 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
C23C 18/1831 (2013.01); C23C 18/1841 (2013.01); C23C 18/1844 (2013.01); H01L 21/288 (2013.01); H05K 1/09 (2013.01); H05K 3/182 (2013.01); C23C 18/36 (2013.01); C23C 18/44 (2013.01); H01L 21/76849 (2013.01); H05K 3/24 (2013.01);
Abstract
The present invention relates to method for activating a copper or copper alloy surface for depositing a metal or metal alloy layer by electroless (autocatalytic) plating thereon wherein the formation of undesired voids is suppressed. The copper or copper alloy surface is contacted with palladium ions, at least one phosphonate compound and halide ions followed by electroless (autocatalytic) deposition of a metal such as palladium or a metal alloy such as a Ni—P alloy.