Rolla, MO, United States of America

Dongshun Bai


 

Average Co-Inventor Count = 4.1

ph-index = 3

Forward Citations = 31(Granted Patents)


Company Filing History:


Years Active: 2012-2021

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8 patents (USPTO):Explore Patents

Title: Celebrating the Innovations of Inventor Dongshun Bai

Introduction

Dongshun Bai, an accomplished inventor based in Rolla, Missouri, has made significant strides in the field of microelectronics with a portfolio of eight patents. His work primarily focuses on developing advanced bonding materials for 3-D integrated circuit (IC) applications, showcasing his commitment to innovation in the semiconductor industry.

Latest Patents

Among his latest innovative contributions is the patent for "Laser-releasable bonding materials for 3-D IC applications." This invention provides novel thermoplastic polyhydroxyether-based compositions that serve as laser-releasable bonding materials for temporary bonding and laser debonding processes. These compositions can be easily debonded using various UV lasers, leaving minimal to no debris behind. Notably, the layers formed possess excellent thermal stability and solubility in commonly-used organic solvents, such as cyclopentanone, making them suitable for build-up layers in redistribution layer (RDL) formation.

Another significant invention is the patent for "Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes." This invention encompasses cyclic olefin polymer bonding compositions and release compositions designed to enhance thin wafer handling during microelectronics manufacturing. The release compositions, made from siloxane polymers and copolymers blended in a polar solvent, exhibit stability at room temperature for over a month. These bonding compositions not only provide high thermal stability but also facilitate mechanical or laser debonding after high-temperature heat treatment, proving to be effective for wafer bonding that can withstand 200°C PECVD processing.

Career Highlights

Dongshun Bai's career is marked by his position at Brewer Science, Inc., where he has become a vital contributor to the company's technological advancements. His innovative work has played a crucial role in pushing the boundaries of microelectronics and further enhancing the efficiency of manufacturing processes.

Collaborations

Throughout his career, Bai has collaborated with esteemed colleagues, including Tony D. Flaim and Rama Puligadda. These collaborations have fostered an environment of shared knowledge and innovation, leading to the creation of cutting-edge technologies in the field.

Conclusion

Dongshun Bai’s contributions to microelectronics through his patents reflect a profound understanding of the complexities involved in bonding technologies. His work not only enhances the capabilities of microelectronics manufacturing but also paves the way for future innovations in the industry. As he continues to develop advanced materials, Dongshun Bai remains a noteworthy figure in the realm of inventors, and his impact will surely resonate for years to come.

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