The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 21, 2014
Filed:
Nov. 08, 2012
Applicant:
Brewer Science Inc., Rolla, MO (US);
Inventors:
Dongshun Bai, Rolla, MO (US);
Xie Shao, Rolla, MO (US);
Michelle Fowler, Rolla, MO (US);
Tingji Tang, Spring, TX (US);
Assignee:
Brewer Science Inc., Rolla, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/31 (2006.01); H01L 21/3105 (2006.01); H01L 21/02 (2006.01); H01L 21/027 (2006.01); C09D 127/18 (2006.01); H01L 29/02 (2006.01); B81C 1/00 (2006.01); C08L 33/16 (2006.01); C08L 33/14 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31058 (2013.01); C08L 33/16 (2013.01); C08L 33/14 (2013.01); H01L 21/02118 (2013.01); H01L 21/0271 (2013.01); C09D 127/18 (2013.01); H01L 29/02 (2013.01); B81C 1/00611 (2013.01); B81C 2201/0119 (2013.01); H01L 21/0212 (2013.01); Y10S 438/958 (2013.01);
Abstract
Planarization methods and microelectronic structures formed therefrom are disclosed. The methods and structures use planarization materials comprising fluorinated compounds or acetoacetylated compounds. The materials are self-leveling and achieve planarization over topography without the use of etching, contact planarization, chemical mechanical polishing, or other conventional planarization techniques.