The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2021
Filed:
Dec. 21, 2018
Applicant:
Brewer Science, Inc., Rolla, MO (US);
Inventors:
Xiao Liu, Rolla, MO (US);
Qi Wu, Rolla, MO (US);
Rama Puligadda, Rolla, MO (US);
Dongshun Bai, Rolla, MO (US);
Baron Huang, Taipei, TW;
Assignee:
Brewer Science, Inc., Rolla, MO (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 71/12 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 21/48 (2006.01); C08K 3/00 (2018.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C08L 71/12 (2013.01); C08K 3/00 (2013.01); H01L 21/4846 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/528 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); C08L 2203/20 (2013.01); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/18161 (2013.01);
Abstract
Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.