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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10968348 B1

PDFFull Text
Date of Patent:
Apr. 06, 2021

Filed:

Dec. 21, 2018

Laser-releasable bonding materials for 3-d ic applications

Applicant:

Brewer Science, Inc., Rolla, MO (US);

Inventors:

Xiao Liu, Rolla, MO (US);

Qi Wu, Rolla, MO (US);

Rama Puligadda, Rolla, MO (US);

Dongshun Bai, Rolla, MO (US);

Baron Huang, Taipei, TW;

Assignee:

Brewer Science, Inc., Rolla, MO (US);

Attorney:

Hovey Williams LLP

Primary Examiner:

Alexander O Williams

Int. Cl.
CPC ...
C08L 71/12 (2006.01); H01L 23/00 (2006.01); H01L 23/31 (2006.01); H01L 23/528 (2006.01); H01L 21/48 (2006.01); C08K 3/00 (2018.01); H01L 21/683 (2006.01);
U.S. Cl.
CPC ...
C08L 71/12 (2013.01); C08K 3/00 (2013.01); H01L 21/4846 (2013.01); H01L 21/4857 (2013.01); H01L 21/6835 (2013.01); H01L 23/3114 (2013.01); H01L 23/528 (2013.01); H01L 24/17 (2013.01); H01L 24/27 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); C08L 2203/20 (2013.01); H01L 23/3121 (2013.01); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2224/0231 (2013.01); H01L 2224/02333 (2013.01); H01L 2224/02379 (2013.01); H01L 2224/131 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/81005 (2013.01); H01L 2224/97 (2013.01); H01L 2924/1033 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/10271 (2013.01); H01L 2924/10329 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/15313 (2013.01); H01L 2924/18161 (2013.01);
Abstract

Novel thermoplastic polyhydroxyether-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are soluble in commonly-used organic solvents (e.g., cyclopentanone). The compositions can also be used as build-up layers for RDL formation.

Find Patent Forward Citations

Liu, Xiao. (2021). Laser-releasable bonding materials for 3-d ic applications (U.S. Patent No. 10968348). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10968348

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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