Company Filing History:
Years Active: 2018-2021
Title: Innovations by Baron Huang in Microelectronics
Introduction
Baron Huang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of microelectronics, particularly in the development of advanced bonding materials. With a total of 2 patents to his name, Huang's work is paving the way for innovative solutions in the industry.
Latest Patents
Huang's latest patents include "Laser-releasable bonding materials for 3-D IC applications" and "Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes." The first patent focuses on novel thermoplastic polyhydroxyether-based compositions that serve as laser-releasable materials for temporary bonding. These compositions can be debonded using various UV lasers, leaving minimal debris behind. They exhibit good thermal stability and solubility in commonly-used organic solvents, making them suitable for build-up layers in RDL formation. The second patent relates to cyclic olefin polymer bonding compositions and release compositions that facilitate thin wafer handling during microelectronics manufacturing. These compositions are stable at room temperature for over a month and provide high thermal stability, allowing for effective mechanical or laser debonding after high-temperature heat treatment.
Career Highlights
Baron Huang is currently employed at Brewer Science, Inc., where he continues to innovate in the field of microelectronics. His work has garnered attention for its practical applications and effectiveness in improving manufacturing processes.
Collaborations
Huang collaborates with talented individuals such as Dongshun Bai and Xiao Liu, contributing to a dynamic research environment that fosters innovation.
Conclusion
Baron Huang's contributions to microelectronics through his patents and collaborations highlight his role as a leading inventor in the field. His innovative bonding materials are set to enhance the efficiency and effectiveness of microelectronics manufacturing processes.