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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9865490 B1

PDFFull Text
Date of Patent:
Jan. 09, 2018

Filed:

Oct. 24, 2016

Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes

Applicant:

Brewer Science Inc., Rolla, MO (US);

Inventors:

Dongshun Bai, Rolla, MO (US);

Gu Xu, Rolla, MO (US);

Debbie Blumenshine, Rolla, MO (US);

Baron Huang, Taipei, TW;

Andrew Wong, Taipei, TW;

Assignee:

Brewer Science Inc., Rolla, MO (US);

Attorney:

Hovey Williams LLP

Primary Examiner:

Shelia V Clark

Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 21/683 (2006.01); H01L 21/50 (2006.01); C08G 77/14 (2006.01); C08G 77/20 (2006.01); C08G 77/18 (2006.01); C08G 77/26 (2006.01); C09J 145/00 (2006.01); C09J 183/06 (2006.01); B32B 7/06 (2006.01); B32B 7/12 (2006.01); B32B 27/08 (2006.01); B32B 27/28 (2006.01); B32B 27/32 (2006.01); C09J 5/06 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6835 (2013.01); B32B 7/06 (2013.01); B32B 7/12 (2013.01); B32B 27/08 (2013.01); B32B 27/283 (2013.01); B32B 27/325 (2013.01); C08G 77/14 (2013.01); C08G 77/18 (2013.01); C08G 77/20 (2013.01); C08G 77/26 (2013.01); C09J 5/06 (2013.01); C09J 145/00 (2013.01); C09J 183/06 (2013.01); H01L 21/50 (2013.01); B32B 2255/10 (2013.01); B32B 2255/205 (2013.01); B32B 2457/14 (2013.01); C09J 2203/326 (2013.01); C09J 2205/302 (2013.01); C09J 2423/00 (2013.01); H01L 2221/6834 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68381 (2013.01);
Abstract

The invention broadly relates to cyclic olefin polymer bonding compositions and release compositions, to be used independently or together, that enable thin wafer handling during microelectronics manufacturing, especially during a full-wafer mechanical debonding process. The release compositions comprise compositions made from siloxane polymers and copolymers blended in a polar solvent, and that are stable at room temperature for longer than one month. The cyclic olefin polymer bonding compositions provide high thermal stability, can be bonded to fully-treated carrier wafers, can be mechanically or laser debonded after high-temperature heat treatment, and are easily removed with an industrially-acceptable solvent. Wafers bonded according to the invention demonstrate lower overall post-grind stack TTV compared to other commercial bonding materials and can survive 200° C. PECVD processing.

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