Gyeonggi-do, South Korea

Dong-Kuk Kim

This inventor holds 8 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2003-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong-Kuk Kim. Retrieved from https://idiyas.com/inventor/dong-kuk-kim-10jmecc5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 37.5

Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 99(Granted Patents)


Location History:

  • Chungchungnam-dong, KR (2003)
  • Chungcheongnam-do, KR (2005)
  • Kyungki-do, KR (2006)
  • Yongin-si, KR (2007)
  • Gyeonggi-do, KR (2006 - 2008)

Company Filing History:


Years Active: 2003-2008

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8 patents (USPTO):Explore Patents

Title: Innovations of Dong-Kuk Kim in Semiconductor Technology

Introduction

Dong-Kuk Kim is a prominent inventor based in Gyeonggi-do, South Korea. He has made significant contributions to the field of semiconductor technology, holding a total of 8 patents. His work focuses on improving the efficiency and reliability of semiconductor packaging processes.

Latest Patents

One of his latest patents is an "Apparatus for stacking semiconductor chips, method for manufacturing semiconductor package using the same and semiconductor package manufactured thereby." This invention relates to an apparatus designed to stack semiconductor chips effectively. It includes two tables for supporting wafers, a picker for handling semiconductor chips, and a picker transfer unit that allows for vertical and horizontal movement. This method enhances productivity in semiconductor package manufacturing by enabling rapid stacking of chips. Additionally, it ensures that a thicker semiconductor chip can protect a thinner one from potential faults caused by external shocks.

Another notable patent is the "Semiconductor multi-chip package and fabrication method." This multi-chip package features a package substrate with bond fingers and a first chip with center bonding pads. The design allows for efficient connections between the bond fingers and the bonding pads, while also incorporating insulating support structures to enhance stability. A second chip is placed over the bonding wire, further optimizing the package's functionality.

Career Highlights

Dong-Kuk Kim is currently employed at Samsung Electronics Co., Ltd., where he continues to innovate in semiconductor technologies. His work has been instrumental in advancing the capabilities of semiconductor packaging, which is crucial for modern electronic devices.

Collaborations

Throughout his career, Dong-Kuk Kim has collaborated with notable colleagues, including Chang-Cheol Lee and Ki-Kwon Jeong. These partnerships have contributed to the development of cutting-edge technologies in the semiconductor industry.

Conclusion

Dong-Kuk Kim's contributions to semiconductor technology through his innovative patents have significantly impacted the industry. His work at Samsung Electronics Co., Ltd. exemplifies the importance of collaboration and innovation in advancing technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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