The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 14, 2006
Filed:
Aug. 10, 2004
Min-ill Kim, Gyeonggi-do, KR;
Dong-kuk Kim, Gyeonggi-do, KR;
Chang-cheol Lee, Chungcheongnam-do, KR;
Tae-hoe Hwang, Chungcheongnam-do, KR;
Jae-young Hong, Chungcheongnam-do, KR;
Min-Ill Kim, Gyeonggi-do, KR;
Dong-Kuk Kim, Gyeonggi-do, KR;
Chang-Cheol Lee, Chungcheongnam-do, KR;
Tae-Hoe Hwang, Chungcheongnam-do, KR;
Jae-Young Hong, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
The present invention relates to an apparatus for stacking semiconductor chips, a method for manufacturing a semiconductor package using the same and a semiconductor package manufactured thereby. The apparatus for stacking semiconductor chips may comprise two tables for supporting wafers, a picker for picking up semiconductor chips and a picker transfer unit for moving the picker vertically and horizontally. The method for manufacturing a semiconductor package using the same may allow easy and rapid stacking of semiconductor chips, thereby improving the productivity of semiconductor package manufacture. Further, a semiconductor chip having a relatively thick film is attached onto another semiconductor chip having a relatively thin film. The thicker semiconductor chip may protect the thinner semiconductor chip from faults such as chipping or warpage which may occur due to external shocks such as that caused by a picker, thereby improving the reliability of the package.