The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 02, 2005
Filed:
Oct. 29, 2002
Dong-kuk Kim, Chungcheongnam-do, KR;
Seung-bae Jeong, Seoul, KR;
Ki-kwon Jeong, Chungcheongnam-do, KR;
Dong-Kuk Kim, Chungcheongnam-do, KR;
Seung-Bae Jeong, Seoul, KR;
Ki-Kwon Jeong, Chungcheongnam-do, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
An automatic wafer backside inspection may automatically inspect a backside of a semiconductor wafer to look for contamination, cracks, scratches and the like. An inspection apparatus may comprise a wafer cassette with slots to hold a plurality of wafers. A wafer transfer arm may be located near the wafer cassette. A wafer flip/aligner may be operable to flip and align wafers. A wafer inspecting unit may be located adjacent the wafer flip/aligner and be operable to inspect the backside of wafers flipped by the flipper aligner. A wafer buffer stage may be located between the wafer cassette and the wafer flip/aligner for temporarily holding a wafer. The wafer transfer arm may transfer wafers to/from or amongst at least two of the wafer cassette, the wafer flip/aligner, the wafer inspection unit and the wafer buffer stage.