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For the Inventor, By the Inventor

Hwaseong, South Korea

Dong-Kil Shin

This inventor holds 7 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2003-2014.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dong-Kil Shin. Retrieved from https://idiyas.com/inventor/dong-kil-shin

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 7

% Patents Active = 85.7

Average Co-Inventor Count = 3.6

ph-index = 3

Forward Citations = 25(Granted Patents)


Location History:

  • Taejeon, KR (2003 - 2005)
  • Daejeon, KR (2004 - 2006)
  • Hwaseong-si, KR (2012 - 2014)

Company Filing History:

goldMedal7 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2003-2014

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7 patents (USPTO):Explore Patents
1. 8922012 - Integrated circuit chip and flip chip package having the integrated circuit chip (2014-12-30),
2. 8427841 - Electronic device (2013-04-23),
3. 8120176 - Semiconductor device having a conductive bump (2012-02-21),
4. 7081375 - Semiconductor package having thermal interface material (TIM) (2006-07-25),
5. 6963033 - Ball grid array attaching means having improved reliability and method of manufacturing same (2005-11-08),
6. 6756668 - Semiconductor package having thermal interface material (TIM) (2004-06-29),
7. 6638638 - Hollow solder structure having improved reliability and method of manufacturing same (2003-10-28),

Title: Innovations of Dong-Kil Shin

Introduction

Dong-Kil Shin is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of integrated circuits and electronic devices. With a total of 7 patents to his name, Shin continues to push the boundaries of technology.

Latest Patents

One of his latest patents is an integrated circuit chip and flip chip package that eliminates the need for wiring lines. In this design, the first electrode pad makes contact with the first bump structure, independent of the wiring line in the pad area. Additionally, the second electrode pad connects with the wiring line in a pseudo pad area, allowing for efficient electrical connections. Another notable patent involves an electronic device that features a first structure with a first land region and a second structure with a second land region. This design includes a connection structure that electrically links the two land regions, enhancing the functionality of electronic devices.

Career Highlights

Dong-Kil Shin is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in developing innovative technologies. His work has significantly impacted the electronics industry, particularly in the realm of integrated circuits.

Collaborations

Shin has collaborated with notable coworkers, including Ho-Jeong Moon and Joong-Hyun Baek, contributing to various projects that advance technology in their field.

Conclusion

Dong-Kil Shin's innovative work in integrated circuits and electronic devices showcases his dedication to advancing technology. His patents reflect a commitment to improving electronic design and functionality.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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