The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Sep. 30, 2010
Jin-woo Park, Cheonan-si, KR;
Eun-chul Ahn, Yongin-si, KR;
Dong-kil Shin, Hwaseong-si, KR;
Sun-won Kang, Seongnam-si, KR;
Jong-ho Lee, Hwaseong-si, KR;
Jin-Woo Park, Cheonan-si, KR;
Eun-Chul Ahn, Yongin-si, KR;
Dong-Kil Shin, Hwaseong-si, KR;
Sun-Won Kang, Seongnam-si, KR;
Jong-Ho Lee, Hwaseong-si, KR;
SAMSUNG Electronics Co., Ltd., Suwon-si, KR;
Abstract
In an integrated circuit (IC) chip and a flip chip package having the same, no wiring line is provided and the first electrode pad does not make contact with the wiring line in a pad area of the IC chip. Thus, the first bump structure makes contact with the first electrode regardless of the wiring line in the pad area. The second electrode pad makes contact with the wiring line in a pseudo pad area of the IC chip. Thus, the second bump structure in the pseudo pad area makes contact with an upper surface of the second electrode at a contact point(s) spaced apart from the wiring line under the second electrode.