Donald D McManus

Title: The Innovative Contributions of Donald D McManus

Introduction

Donald D McManus is a notable inventor based in Bedford, NH (US). He has made significant contributions to the field of technology, particularly in the development of advanced thermal imaging systems. With a total of 2 patents, McManus has demonstrated his expertise and creativity in engineering.

Latest Patents

One of his latest patents is the "Stacked Modular Architecture High-Resolution Thermal Chip Camera." This invention features an uncooled high-resolution 12-micron pixel pitch 3D-stacked component thermal camera. It includes an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer-level packaged Focal Plane Array (FPA) wafer, and a lens housing attach ring on the FPA, along with a window. Another significant patent is the "Dual Bus Memory Controller." This memory controller initiates a first memory access in response to a first memory access request. It can receive a second memory access request and initiate a second memory access before completing the first memory access.

Career Highlights

Throughout his career, McManus has worked with prominent companies such as Intel Corporation and BAE Systems Information and Electronic Systems Integration Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking projects in the technology sector.

Collaborations

Some of his notable coworkers include Steven W Zagorianakos and Louise C Sengupta. Their collaboration has likely fostered an environment of innovation and creativity, leading to the development of advanced technologies.

Conclusion

Donald D McManus is a distinguished inventor whose work has significantly impacted the field of thermal imaging and memory control systems. His patents reflect his innovative spirit and dedication to advancing technology.