Intel Corporation

Bae Systems Information and Electronic Systems Integration Inc.

Donald D McManus

Louise C Sengupta

Steven W Zagorianakos

Pierre-Alain S Auroux

Don A Harris

Richard J Blackwell, Jr

Jeffrey F Bryant

Mihir D Boal

Evan A Binkerd

An uncooled high-resolution 12 micron pixel pitch 3D-stacked component thermal camera including an electronics board, a camera circuit card assembly (CCA) with an application-specific integrated circuit (ASIC), a synchronous dynamic random access memory (SDRAM), flash memory, a spacer, a wafer level packaged Focal Plane Array (FPA) wafer with a lens housing attach ring on the FPA, and a window.

Stacked modular architecture high-resolution thermal chip camera

A memory controller initiates a first memory access in response to receipt of a first memory access request. The memory controller receives a second memory access request and initiates a second memory access in response to receipt of the second memory request prior to completing the first memory access.

Dual bus memory controller

Growing community of inventors

Bedford, NH, United States of America

Donald D McManus