IDiyas

For the Inventor, By the Inventor

Mesa, AZ, United States of America

Donald Craig Foster

USPTO Granted Patents = 21 

Average Co-Inventor Count = 1.4

ph-index = 14

Forward Citations = 987(Granted Patents)


Company Filing History:

goldMedal20 out of 1,009 
 
Amkor Technology, Inc.
 patents
silverMedal1 out of 3,715 
 
Lsi Logic Corporation
 patents

Years Active: 2000-2015

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21 patents (USPTO):Explore Patents
1. 9123718 - Shielded package having shield lid (2015-09-01),
2. 8552539 - Shielded package having shield lid (2013-10-08),
3. 8551820 - Routable single layer substrate and semiconductor package including same (2013-10-08),
4. 8362597 - Shielded package having shield lid (2013-01-29),
5. 7629674 - Shielded package having shield fence (2009-12-08),
6. 7245007 - Exposed lead interposer leadframe package (2007-07-17),
7. 7211471 - Exposed lead QFP package fabricated through the use of a partial saw process (2007-05-01),
8. 7176062 - Lead-frame method and assembly for interconnecting circuits within a circuit module (2007-02-13),
9. 7102216 - Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making (2006-09-05),
10. 6995459 - Semiconductor package with increased number of input and output pins (2006-02-07),
11. 6900527 - Lead-frame method and assembly for interconnecting circuits within a circuit module (2005-05-31),
12. 6876068 - Semiconductor package with increased number of input and output pins (2005-04-05),
13. 6818973 - Exposed lead QFP package fabricated through the use of a partial saw process (2004-11-16),
14. 6791166 - Stackable lead frame package using exposed internal lead traces (2004-09-14),
15. 6686651 - Multi-layer leadframe structure (2004-02-03),

Title: The Innovative Mind of Donald Craig Foster

Introduction

Donald Craig Foster, based in Mesa, AZ, is a prolific inventor with a remarkable portfolio of 21 patents. His contributions to the field of electronics and packaging technologies demonstrate his ingenuity and commitment to innovation.

Latest Patents

Among his latest innovations, Foster has developed a shielded package featuring a shield lid and a shield fence, designed to enhance the performance of electronic components. This package utilizes a unique adhesive that electrically couples the shield lid to the shield fence, while ensuring effective molding through a porous sidewall. Additionally, his invention of a routable single-layer substrate is notable for its application in Dual and Quad Flat No-Lead (DFN/QFN) semiconductor packages. This patent introduces a fabrication method that streamlines the manufacturing process by effectively eliminating metal from saw streets, contributing to a more stable surface for wire bonding.

Career Highlights

Throughout his career, Donald Craig Foster has made significant contributions while working at prominent companies such as Amkor Technology, Inc. and LSI Logic Corporation. His roles in these organizations have allowed him to push the boundaries of technology and develop groundbreaking solutions in the semiconductor industry.

Collaborations

Foster has collaborated with several talented professionals, including Choon Heung Lee and Jeoung Kyu Choi. These partnerships have further enriched his inventive process, enabling the development of technologies that address complex challenges in electronics.

Conclusion

With a distinguished career marked by numerous patents and innovations, Donald Craig Foster continues to be a leading figure in the field of electronics and packaging technology. His work exemplifies the spirit of innovation that drives advancements in the semiconductor industry.

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