Donald Craig Foster

This inventor holds 21 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Amkor Technology, Inc., Lsi Logic Corporation. Active years: 2000-2015.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Donald Craig Foster. Retrieved from https://idiyas.com/inventor/donald-craig-foster

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 21 (Patent Applications = 2)

% Patents Active = 95.2

Average Co-Inventor Count = 1.4

ph-index = 14

Forward Citations = 997(Granted Patents)

Company Filing History:

20 out of 1,009

Amkor Technology, Inc.

patents

1 out of 3,715

Lsi Logic Corporation

patents

Years Active: 2000-2015

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Areas of Expertise:

Shielded Package

Lead-Frame Method

Multi-Layer Leadframe

Exposed Lead QFP

Stackable Lead Frame

Cavity Down Package

Active Heat Sink

Input Output Pins

Isolated Ring Structure

Interconnecting Circuits

Die-to-Die Interconnect

Partial Saw Process

21 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 9123718 - Shielded package having shield lid (2015-09-01),

2. 8552539 - Shielded package having shield lid (2013-10-08),

3. 8551820 - Routable single layer substrate and semiconductor package including same (2013-10-08),

4. 8362597 - Shielded package having shield lid (2013-01-29),

5. 7629674 - Shielded package having shield fence (2009-12-08),

6. 7245007 - Exposed lead interposer leadframe package (2007-07-17),

7. 7211471 - Exposed lead QFP package fabricated through the use of a partial saw process (2007-05-01),

8. 7176062 - Lead-frame method and assembly for interconnecting circuits within a circuit module (2007-02-13),

9. 7102216 - Semiconductor package and leadframe with horizontal leads spaced in the vertical direction and method of making (2006-09-05),

10. 6995459 - Semiconductor package with increased number of input and output pins (2006-02-07),

11. 6900527 - Lead-frame method and assembly for interconnecting circuits within a circuit module (2005-05-31),

12. 6876068 - Semiconductor package with increased number of input and output pins (2005-04-05),

13. 6818973 - Exposed lead QFP package fabricated through the use of a partial saw process (2004-11-16),

14. 6791166 - Stackable lead frame package using exposed internal lead traces (2004-09-14),

15. 6686651 - Multi-layer leadframe structure (2004-02-03),

Title: The Innovative Mind of Donald Craig Foster

Introduction

Donald Craig Foster, based in Mesa, AZ, is a prolific inventor with a remarkable portfolio of 21 patents. His contributions to the field of electronics and packaging technologies demonstrate his ingenuity and commitment to innovation.

Latest Patents

Among his latest innovations, Foster has developed a shielded package featuring a shield lid and a shield fence, designed to enhance the performance of electronic components. This package utilizes a unique adhesive that electrically couples the shield lid to the shield fence, while ensuring effective molding through a porous sidewall. Additionally, his invention of a routable single-layer substrate is notable for its application in Dual and Quad Flat No-Lead (DFN/QFN) semiconductor packages. This patent introduces a fabrication method that streamlines the manufacturing process by effectively eliminating metal from saw streets, contributing to a more stable surface for wire bonding.

Career Highlights

Throughout his career, Donald Craig Foster has made significant contributions while working at prominent companies such as Amkor Technology, Inc. and LSI Logic Corporation. His roles in these organizations have allowed him to push the boundaries of technology and develop groundbreaking solutions in the semiconductor industry.

Collaborations

Foster has collaborated with several talented professionals, including Choon Heung Lee and Jeoung Kyu Choi. These partnerships have further enriched his inventive process, enabling the development of technologies that address complex challenges in electronics.

Conclusion

With a distinguished career marked by numerous patents and innovations, Donald Craig Foster continues to be a leading figure in the field of electronics and packaging technology. His work exemplifies the spirit of innovation that drives advancements in the semiconductor industry.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

2 patents pending: