The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 13, 2007
Filed:
Jan. 13, 2005
Jeffrey Alan Miks, Chandler, AZ (US);
Kenneth Kaskoun, Phoenix, AZ (US);
Markus Liebhard, Chandler, AZ (US);
Donald Craig Foster, Mesa, AZ (US);
Paul Robert Hoffman, Chandler, AZ (US);
Frederic Bertholio, Oruck, FR;
Jeffrey Alan Miks, Chandler, AZ (US);
Kenneth Kaskoun, Phoenix, AZ (US);
Markus Liebhard, Chandler, AZ (US);
Donald Craig Foster, Mesa, AZ (US);
Paul Robert Hoffman, Chandler, AZ (US);
Frederic Bertholio, Oruck, FR;
Amkor Technology, Inc., Chandler, AZ (US);
Abstract
A lead-frame method and assembly for interconnecting circuits within a circuit module allows a circuit module to be fabricated without a circuit board substrate. Integrated circuit dies are attached to a metal lead-frame assembly and the die interconnects are wire-bonded to interconnect points on the lead-frame assembly. An extension of the lead-frame assembly out of the circuit interconnect plane provides external electrical contacts for connection of the circuit module to a socket.