Singapore, Singapore

Dingwei Xia


Average Co-Inventor Count = 2.0

ph-index = 1


Company Filing History:


Years Active: 2014-2016

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2 patents (USPTO):

Title: Innovations by Dingwei Xia in Semiconductor Molding Technology

Introduction

Dingwei Xia is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds two patents that showcase his innovative approach to molding processes in the semiconductor industry. His work has significantly impacted the efficiency and effectiveness of semiconductor manufacturing.

Latest Patents

Dingwei Xia's latest patents include an apparatus for molding a semiconductor wafer and the associated processes. This invention features mold pieces designed for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer. The apparatus includes a primary cavity and secondary cavities that allow excess mold compound to flow from the primary cavity. The secondary cavities are equipped with a plunger that applies a predetermined backpressure, ensuring the desired mold compound pressure during the molding process. This design allows for a relatively thin layer of mold compound to remain on the semiconductor wafer, which can be efficiently removed, for example, by grinding. Additionally, the mold piece incorporates a movable cavity bar that can be detached from the molded substrate after cooling, enhancing the overall efficiency of the process.

Career Highlights

Dingwei Xia is currently employed at Advanced Systems Automation Limited, where he continues to develop innovative solutions in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor manufacturing processes.

Collaborations

Dingwei Xia has collaborated with notable colleagues, including Jimmy Chew Hwee Seng and Hwee Seng Jimmy Chew, contributing to a dynamic and innovative work environment.

Conclusion

Dingwei Xia's contributions to semiconductor molding technology exemplify the importance of innovation in the field. His patents reflect a commitment to improving manufacturing processes, which can lead to more efficient and effective semiconductor production.

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