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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 9524885 B1

PDFFull Text
Date of Patent:
Dec. 20, 2016

Filed:

Jul. 29, 2014

Apparatus for molding a semiconductor wafer and process therefor

Applicant:

Advanced Systems Automation Ltd., Singapore, SG;

Inventors:

Jimmy Chew Hwee Seng, Singapore, SG;

Dingwei Xia, Singapore, SG;

Assignee:

ADVANCED SYSTEMS AUTOMATION LTD., Singapore, SG;

Attorneys:

Jackson Walker LLP

Christopher J. Rourk

Primary Examiner:

Thanh Y Tran

Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 21/56 (2006.01); B29C 45/26 (2006.01); B29C 45/73 (2006.01); B29C 43/36 (2006.01); B29C 43/50 (2006.01); H01L 21/67 (2006.01); B29C 45/14 (2006.01); B29C 45/38 (2006.01); B29C 45/77 (2006.01); H01L 23/31 (2006.01); B29L 31/34 (2006.01);
U.S. Cl.
CPC ...
H01L 21/565 (2013.01); B29C 43/36 (2013.01); B29C 43/50 (2013.01); B29C 45/2669 (2013.01); B29C 45/73 (2013.01); H01L 21/67126 (2013.01); B29C 45/14655 (2013.01); B29C 45/38 (2013.01); B29C 45/77 (2013.01); B29C 2045/7393 (2013.01); B29L 2031/3481 (2013.01); H01L 23/3114 (2013.01); H01L 2924/0002 (2013.01);
Abstract

Mold pieces (and) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer () include a primary cavity () and secondary cavities () into which excess mold compound from the primary cavity () flows. The secondary cavities () include a plunger () that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity () is forced to flow into the secondary cavities (), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (), which can then be removed, for example by grinding, in a relatively short time. Mold piece () further comprises a movable cavity bar () that can be moved away from mold piece () after molding and be cooled to detach the molded substrate that adheres to the cavity bar.

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