The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2014
Filed:
Oct. 04, 2002
Hwee Seng Jimmy Chew, Singapore, SG;
Dingwei Xia, Singapore, SG;
Hwee Seng Jimmy Chew, Singapore, SG;
Dingwei Xia, Singapore, SG;
Advanced Systems Automation Ltd., Singapore, SG;
Abstract
Mold pieces (and) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer () include a primary cavity () and secondary cavities () into which excess mold compound from the primary cavity () flows. The secondary cavities () include a plunger () that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity () is forced to flow into the secondary cavities (), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (), which can then be removed, for example by grinding in a relatively short time. Mold piece () further comprises a movable cavity bar () that can be moved away from mold piece () after molding and be cooled to detach the molded substrate that adheres to the cavity bar.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile