Advanced Systems Automation Limited

Dingwei Xia

Hwee Seng Jimmy Chew

Jimmy Chew Hwee Seng

Mold pieces (and) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer () include a primary cavity () and secondary cavities () into which excess mold compound from the primary cavity () flows. The secondary cavities () include a plunger () that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity () is forced to flow into the secondary cavities (), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (), which can then be removed, for example by grinding, in a relatively short time. Mold piece () further comprises a movable cavity bar () that can be moved away from mold piece () after molding and be cooled to detach the molded substrate that adheres to the cavity bar.

Apparatus for molding a semiconductor wafer and process therefor

Mold pieces (and) for molding a layer of mold compound on the interconnect side of a bumped semiconductor wafer () include a primary cavity () and secondary cavities () into which excess mold compound from the primary cavity () flows. The secondary cavities () include a plunger () that asserts a predetermined backpressure that is equal to a desired mold compound pressure on the mold compound during molding. As most of the excess mold compound in the primary cavity () is forced to flow into the secondary cavities (), this advantageously leaves a relatively thin layer of mold compound on the semiconductor wafer (), which can then be removed, for example by grinding in a relatively short time. Mold piece () further comprises a movable cavity bar () that can be moved away from mold piece () after molding and be cooled to detach the molded substrate that adheres to the cavity bar.

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Singapore, Singapore

Dingwei Xia