Company Filing History:
Years Active: 2014-2015
Title: The Innovations of Ding Hui Xu
Introduction
Ding Hui Xu is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of integrated circuit technology, holding a total of 2 patents. His work focuses on enhancing the efficiency and functionality of electronic devices through innovative packaging systems and circuits.
Latest Patents
Ding Hui Xu's latest patents include an integrated circuit packaging system with an interposer and a method of manufacture thereof. This method involves providing an interposer with a bottom and top side, attaching a base integrated circuit to the bottom side, and forming an encapsulation that partially covers the lead while exposing the top side. Another notable patent is a level shift circuit designed to meet the requirements of the BCD process, which prevents damage to high-voltage devices due to excessively high gate voltage. This circuit includes multiple modules and terminals that facilitate efficient signal processing.
Career Highlights
Throughout his career, Ding Hui Xu has worked with notable companies such as Stats Chippac Pte. Ltd. and Shanghai Belling Corporation. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects in the electronics industry.
Collaborations
Ding Hui Xu has collaborated with several professionals in his field, including Wei Qiang Jin and Zhengcai Qin. These collaborations have further enhanced his work and contributed to the development of advanced technologies.
Conclusion
Ding Hui Xu's contributions to integrated circuit technology and his innovative patents demonstrate his expertise and commitment to advancing the field. His work continues to influence the development of electronic devices, making him a significant figure in the industry.