Stats Chippac Pte. Ltd.

Shanghai Belling Corp., Ltd.

Ding Hui Xu

Nan Liu

Wei Qiang Jin

Ning Lu

Dajun Wu

Zhengcai Qin

Qifu Liu

Chengjie Zhou

A method of manufacture of an integrated circuit packaging system includes: providing an interposer having an interposer bottom side and an interposer top side; attaching a base integrated circuit to the interposer bottom side; attaching a lead to the interposer bottom side, the lead adjacent the base integrated circuit and entirely below the interposer; and forming an encapsulation partially covering the lead and exposing the interposer top side.

Integrated circuit packaging system with interposer and method of manufacture thereof

Provided is a level shift circuit which includes: a first level shift module; a first signal input terminal for providing a first input signal for the first level shift module; a first signal output terminal for providing output from the first level shift module; a second level shift module; a second signal input terminal for providing a second input signal for the second level shift module; a second signal output terminal for providing output from the second level shift module; a drive module connected to the first signal output terminal and the second signal output terminal; and a drive signal output terminal from the drive module. The level shift circuit of the present invention can be applicable for the requirements of BCD process and prevent damages to the high-voltage device due to the excessively high gate voltage.

Level shift circuit

Growing community of inventors

Shanghai, China

Ding Hui Xu