Burghausen, Germany

Dieter Gräf


Average Co-Inventor Count = 5.4

ph-index = 2

Forward Citations = 34(Granted Patents)


Company Filing History:


Years Active: 2001-2003

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3 patents (USPTO):Explore Patents

Title: The Innovations of Dieter Gräf

Introduction

Dieter Gräf is a notable inventor based in Burghausen, Germany. He has made significant contributions to the field of semiconductor technology, holding a total of three patents. His work has had a lasting impact on the industry, particularly in the production and calibration of semiconductor wafers.

Latest Patents

Dieter Gräf's latest patents include a method for the production of an epitaxially grown semiconductor wafer. This invention is crucial for enhancing the quality and efficiency of semiconductor manufacturing. Another significant patent is a standard for calibrating and checking a surface inspection device, along with the method for its production. This invention relates to a reproducible standard for calibrating and checking the bright-field channel of a surface inspection device used for examining the flat surface of a sample. The method involves producing a microstructure on a substrate surface, characterized by the smoothing out of the microstructure.

Career Highlights

Throughout his career, Dieter Gräf has worked with prominent companies in the semiconductor industry, including Wacker Siltronic Gesellschaft für Halbleiter Materialien AG. His expertise and innovative approach have positioned him as a key figure in the development of advanced semiconductor technologies.

Collaborations

Dieter Gräf has collaborated with notable professionals in his field, including Rüdiger Schmolke and Wilfried Von Ammon. These collaborations have further enriched his work and contributed to the advancements in semiconductor technology.

Conclusion

Dieter Gräf's contributions to the semiconductor industry through his patents and collaborations highlight his role as an influential inventor. His work continues to shape the future of semiconductor manufacturing and technology.

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