San Diego, CA, United States of America

Dhamim Packer Ali

This inventor holds 15 USPTO granted patents and 7 published patent applications and 4 EPO patents, primarily in System-On-Chip Design. Top assignees: Qualcomm Incorporated, Kyocera Wireless Corporation. Active years: 2008-2022.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dhamim Packer Ali. Retrieved from https://idiyas.com/inventor/dhamim-packer-ali

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15 

% Patents Active = 73.3

 

Average Co-Inventor Count = 4.2

ph-index = 2

Forward Citations = 18(Granted Patents)


Company Filing History:


Years Active: 2008-2022

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Areas of Expertise:
SDIO Protocol
Boot Time Optimization
Calibration Parameters
Multicore Framework
Firmware Patch
Power Mode Selection
Secure Stack Protection
Flash Memory
Image Upgrade
Failure Recovery
Persistent Files
Virtual Boundary Codes
15 patents (USPTO):Explore Patents

Title: Innovator Spotlight: Dhamim Packer Ali from San Diego, CA

Introduction: Dhamim Packer Ali is a distinguished inventor based in San Diego, California. With a remarkable portfolio of 15 patents, he has made significant contributions to the field of technology, particularly in the realm of chip-to-chip communication and system-on-chip calibration. His innovative spirit and technical expertise have established him as a prominent figure among contemporary inventors.

Latest Patents: Among his latest innovations is the "SDIO chip-to-chip interconnect protocol extension for slow devices and power savings." This patent addresses the challenge of synchronization over a secure digital (SD) bus. The method enhances efficiency by interrupting the SD host for an SD extended command and ensuring smooth communication between the SD host and client device.

Another notable invention is the "boot time determination of calibration parameters for a component coupled to a system-on-chip." This method emphasizes the importance of calibrating external components efficiently. By receiving previous calibration parameters at a secondary system-on-chip (SoC) and determining their validity, this approach optimizes the operation of the external component, enhancing overall system performance.

Career Highlights: Dhamim Packer Ali has an impressive career, having worked for industry leaders such as Qualcomm Incorporated and Kyocera Wireless Corporation. His roles in these companies have allowed him to hone his skills and contribute to high-impact projects, further advancing his expertise in innovative technologies.

Collaborations: Dhamim has collaborated with several talented individuals throughout his career, including co-inventors Dhaval Kanubhai Patel and Sreenivasulu Reddy Chalamcharla. Together, they have worked on several projects that leverage their combined knowledge and experience to push the boundaries of technology.

Conclusion: Dhamim Packer Ali's contributions to the field of technology through his patents and collaborations reflect his dedication to innovation. His work not only enhances the functionality of devices but also paves the way for future advancements in chip communication and calibration methods. As an inventor, he continues to inspire those in the tech industry and set a benchmark for aspiring innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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