Chandler, AZ, United States of America

Devarajan Balaraman

This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2010-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Devarajan Balaraman. Retrieved from https://idiyas.com/inventor/devarajan-balaraman-leq268um

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 5.0

ph-index = 1

Forward Citations = 23(Granted Patents)


Company Filing History:


Years Active: 2010-2013

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2 patents (USPTO):Explore Patents

Title: Devarajan Balaraman: Innovator in Semiconductor Packaging

Introduction

Devarajan Balaraman is a notable inventor based in Chandler, AZ, who has made significant contributions to the field of semiconductor packaging. With a total of 2 patents to his name, Balaraman's work focuses on innovative methods and materials that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Balaraman's latest patents is titled "Method and Core Materials for Semiconductor Packaging." This invention describes a semiconductor package that includes a semiconductor substrate, which may comprise a core made from various materials such as ceramics and glass dielectrics. The package features a set of inner conductive elements on the core and outer conductive elements on the substrate's outer side. Additionally, a semiconductor die is coupled to the substrate through the outer conductive elements. The core materials can include alumina, zirconia, carbides, nitrides, fused silica, quartz, sapphire, and Pyrex. The patent also details the use of lasers to drill plated through holes, allowing for the coupling of inner and outer conductive elements, while a dielectric layer insulates the outer conductive elements from the core or inner conductive elements.

Career Highlights

Balaraman is currently employed at Intel Corporation, where he continues to push the boundaries of semiconductor technology. His work at Intel has positioned him as a key player in the development of advanced packaging solutions that are critical for modern electronic devices.

Collaborations

Throughout his career, Balaraman has collaborated with talented individuals such as Yonggang Li and Amruthavalli Palla Alur. These collaborations have fostered an environment of innovation and creativity, leading to advancements in semiconductor packaging technologies.

Conclusion

Devarajan Balaraman's contributions to semiconductor packaging through his innovative patents and work at Intel Corporation highlight his importance in the field. His ongoing efforts continue to shape the future of semiconductor technology, making significant impacts on the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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